ACiG Technology has selected German RFID component supplier KSW Microtec AG to provide its Thinlam RFID inlays for ACiG’s smart card products. Under the terms of the deal, KSW becomes ACiG’s primary supplier of thin pre-laminated products for its HF RFID smart card applications.
The KSW Thinlam inlay measures in at a thickness of just 280 micrometers. The thin profile, achieved by manufacturing the component without chip modules, enables manufacturers to produce HF and UHF RFID smart cards with more layers, broadening the potential to integrate additional security and other high-value features into the cards. The inlays maintain a high level of durability despite their thinness due to a patented chip connection technology.
KSW claims the lack of chip modules results in smoother card surfaces and better printing outcomes. Depending on a customer’s requirements, Thinlam can be manufactured on PVC, polycarbonate, PET or Teslin and can also be used in transparent RFID cards
ACiG Technology AG is an independent supplier and value-added distributor of RFID and smartcard IC’s, inlays, reader modules and other components. The company provides products and services to customers in Europe, Africa, the Middle East, and the Americas. It has a direct partnership with RFID manufacturer NXP. ![[end]](/resources/bullet/rfidnews-4.gif)
