Custom RFID inlay developer Rfidium RFID has announced a development agreement with Ramtron International Corp., a developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products. Under the terms of the agreement, the two firms will collaborate on the design and testing of RFID inlays utilizing a new line of high-memory, EPC Class1 Gen 2 RFID chips from Ramtron.

Rfidium, a division of the UK’s Block Shield Corp., plans a range of UHF antennas designed to Ramtron’s specifications. The inlay developer will produce prototype samples in aluminum with Ramtron chips and perform inlay characterization and qualification.